Source: USG Corporation
Latest innovation in USG’s history of solving evolving construction challenges simplifies field assembly for structural ceilings in mission critical projects
CHICAGO – September 1, 2026 – USG is expanding its data center portfolio with Modulock™ Technology, a new structural ceiling innovation designed to simplify field assembly for increasingly complex data center construction. Building on USG’s long history of innovation and developing solutions for jobsite challenges, Modulock™ Technology rethinks how structural ceiling components come together in the field to simplify assembly while maintaining the performance these complex environments require.
Data center projects present a distinct set of construction challenges, from heavy overhead loads and dense building systems to tight coordination requirements and limited tolerance for rework. Modulock™ Technology addresses these challenges with a streamlined approach designed to reduce installation complexity and improve efficiency in the field.
The new technology replaces the need for field-installed connectors, turnbuckles and bolts, simplifying assembly and reducing the number of steps required during installation. Modulock™ assemblies and pre-assembled cross tees arrive ready to install and integrate seamlessly with USG ALTA™ Structural Suspension System.
“At USG, innovation starts with understanding how construction is changing and where we can make the building process work better,” said Travis Tomanek, Head of Sales, Mission Critical Solutions, USG. “With Modulock™ Technology, we looked beyond the installation of the structural ceiling and focused on accelerating overall data center project delivery. By simplifying what happens in the field, we can help contractors reduce labor risk and work more efficiently, moving them to the next job faster.”
USG Modulock™ Technology features a proprietary boltless locking design that connects with pre-assembled cross tees and delivers a load capacity of up to 1,200 pounds. By combining strength with a simplified, ready-to-install assembly, the technology is designed to help contractors increase installation efficiency, leading to critical-path protection with earlier release to MEP trades, commissioning, and turnover—and even eliminate rework.
The launch builds on USG’s focus on developing solutions in response to new and evolving construction challenges. Modulock™ Technology is the latest innovation in USG’s Mission Critical Solutions portfolio: a single source for integrated aisle containment solutions for data centers.
“Product innovation today isn’t only about making something stronger or higher-performing—it’s also about finding new ways to make construction more efficient,” added Tomanek. “Modulock™ Technology is an example of how we’re applying our expertise to the challenges our customers are facing now: helping them simplify installation and make the most of their time and labor.”
For more information about USG Modulock™ Technology and USG Mission Critical Solutions, USG’s Modulock Technology release.
About USG Corp.
USG Corporation, an industry-leading manufacturer of building products and innovative solutions, is the parent company of CGC and USG LATAM. Headquartered in Chicago, we serve construction markets around the world with wall, ceiling, flooring, sheathing and roofing products that enable our customers to build the outstanding spaces where people live, work and play. For additional information, visit USG Corp.
View the supplied USG Modulock product video (Google Drive).